Intel 4工艺本质上就是英特尔原来的7nm工艺，Meteor Lake是首个应用该工艺的英特尔酷睿处理器。据称，英特尔在Intel 4工艺上的目标是相同功耗情况下，有超过20%的频率提升，实现两倍的高性能库缩放，同时将广泛使用极紫外（EUV）技术。Meteor Lake采用了模块化设计，可以搭配不同制程节点的模块进行堆叠，再使用EMIB技术互联和Foveros封装技术。

Meteor Lake-P的内核照片显示其拥有6个性能核和8个能效核，前者将启用Redwood Cove架构，以取代目前的Golden Cove架构，后者会改用Crestmont架构，替换掉Gracemont架构。Meteor Lake应该会有四个不同的模块，分别是计算模块、SOC模块、I/O模块和GPU模块。

预计英特尔会在2023年下半年推出Meteor Lake，其中桌面平台将使用新的LGA 1851插座。

预览var tableid = settableid(); document.write(''); Table().init({ title: "英特尔酷睿桌面处理器参数表", header: ["规格","Coffee Lake-S","Comet Lake-S","Rocket Lake-S","Alder Lake-S","Raptor Lake-S","Meteor Lake-S","Arrow Lake-S","Lunar Lake-S","Nova Lake-S"], width: '92%', columnWidth: 'MAX', //表格单元宽度，"MAX"最大内容显示，""AVG"平均，"AUTO"自动，指定[15,16,20] id: tableid, data: [ ["发布年份","2018","2020","2021Q1","2021Q4","2022","2023?","2024?","2024+?","2026?"], ["工艺节点","14nm","14nm","14nm","Intel 7","Intel 7","Intel 4 & 20ATSMC N3","Intel 4 & 20ATSMC N3","Intel 18ATSMC N2?","TBC"], ["核心架构","SkyLake","SkyLake","Cypress Cove","Golden CoveGracemont","Raptor CoveGracemont","Redwood CoveCrestmont","TBC","Lion CoveSkymont","Panther CoveDarkmont"], ["核显","Gen9","Gen9.5","Gen12","Gen12","Gen12?","Gen 12?","TBC","Gen 13","TBC"], ["最大核心数","8","10","8","16 (8+8)","24 (8+16)","TBC","40 (8+32)","TBC","TBC"], ["插座","LGA1151","LGA1200","LGA1200","LGA1700","LGA1700","TBC","TBC","TBC","TBC"], ["内存支持","DDR4","DDR4","DDR4","DDR4/5","DDR4/DDR5","DDR5","TBC","TBC","TBC"], ["PCIe版本","PCIe 3.0","PCIe 3.0","PCIe 4.0","PCIe 5.0","PCIe 5.0","PCIe 5.0?","PCIe 5.0?","PCIe 5.0?","PCIe 6.0?"], ["主板芯片组","Intel 300系列","Intel 400系列","Intel 500系列","Intel 600系列","Intel 700系列?","TBC","TBC","TBC","TBC"] ] });

据Benchlife报道，下一代LGA 1851插座的尺寸为45 × 37.5 mm，与Alder Lake和Raptor Lake的LGA 1700/1800相同，因此有可能在CPU散热器方面保留一定的兼容性。泄露的PPT资料显示，LGA 1851插座的IHS（集成散热器）高度为6.83mm至7.49mm，相比目前的LGA 1700插座的6.73mm至7.4mm有所改变。

Meteor Lake的高度改变，很可能是由于新架构采用了Foveros封装技术的结果。与以往不同的是，从PPT上的信息来看，Meteor Lake似乎会是Arrow Lake的继任者，与之前一直流传的消息相反，不过英特尔至今没有分享太多有关Arrow Lake的信息，具体情况还有待观察。

预览var tableid = settableid(); document.write(''); Table().init({ title: "英特尔酷睿桌面处理器参数表", header: ["规格","Coffee Lake-S","Comet Lake-S","Rocket Lake-S","Alder Lake-S","Raptor Lake-S","Meteor Lake-S","Arrow Lake-S","Lunar Lake-S","Nova Lake-S"], width: '92%', columnWidth: 'MAX', //表格单元宽度，"MAX"最大内容显示，""AVG"平均，"AUTO"自动，指定[15,16,20] id: tableid, data: [ ["发布年份","2018","2020","2021Q1","2021Q4","2022","2023?","2024?","2024+?","2026?"], ["工艺节点","14nm","14nm","14nm","Intel 7","Intel 7","Intel 4 & 20ATSMC N3","Intel 4 & 20ATSMC N3","Intel 18ATSMC N2?","TBC"], ["核心架构","SkyLake","SkyLake","Cypress Cove","Golden CoveGracemont","Raptor CoveGracemont","Redwood CoveCrestmont","TBC","Lion CoveSkymont","Panther CoveDarkmont"], ["核显","Gen9","Gen9.5","Gen12","Gen12","Gen12?","Gen 12?","TBC","Gen 13","TBC"], ["最大核心数","8","10","8","16 (8+8)","24 (8+16)","TBC","40 (8+32)","TBC","TBC"], ["插座","LGA1151","LGA1200","LGA1200","LGA1700","LGA1700","TBC","TBC","TBC","TBC"], ["内存支持","DDR4","DDR4","DDR4","DDR4/5","DDR4/DDR5","DDR5","TBC","TBC","TBC"], ["PCIe版本","PCIe 3.0","PCIe 3.0","PCIe 4.0","PCIe 5.0","PCIe 5.0","PCIe 5.0?","PCIe 5.0?","PCIe 5.0?","PCIe 6.0?"], ["主板芯片组","Intel 300系列","Intel 400系列","Intel 500系列","Intel 600系列","Intel 700系列?","TBC","TBC","TBC","TBC"] ] });

根据过往的消息，Meteor Lake和Arrow Lake分别会在2023年和2024年发布，采用Tile设计，通过EMIB互联技术和Foveros封装技术，将不同制程节点和晶圆厂制造的模块进行堆叠，并封装在一起。其中涉及到的工艺包括了Intel4和Intel 20A，以及台积电的N3。普遍认为Meteor Lake和Arrow Lake将使用同一个平台，两者之间的关系类似于Alder Lake和Raptor Lake。

在前一段时间与分析师和投资者举行的财报电话会议中，英特尔CEO帕特-基尔辛格（Pat Gelsinger）表示，Meteor Lake（第14代酷睿）已成功地在Windows、Chrome和Linux系统中点亮，这是一个新的里程碑，标志着Intel 4工艺（7nm制程）技术进展顺利。随后英特尔又在Intel Vision向参观媒体展示了Meteor Lake芯片，两种封装方式，分别为“标准”和“高密度”。

据了解，Meteor Lake将首先在移动平台上推出，也是第一个采用Xe-HPG架构的酷睿系列。传闻Arrow Lake-P的核显将配备多达320个EU，是Alder Lake-P的三倍有余。

Le Comptoir du Hardware拍摄到了Meteor Lake的CPU Tile，这块小芯片应该是用在超低功耗设备的Meteor Lake，上面有两个P-Core和8个E-Core，他们分别用的是Redwood Cove架构和Crestmont架构。这块芯片上明显缺少了图形部分和I/O部分，这些东西被交由其他小芯片负责了，换句话来说这芯片和AMD锐龙处理器上的CCD性质差不多。

@Locuza_对这张CPU Tile照片进行了标注，作为P-Core的Redwood Cove看起来就是进化版的Golden Cove，它看起来拥有2MB的L2缓存，而在Golden Cove上则是1.25MB，至于E-Core的Crestmont的L2缓存可能是2MB也有可能是4MB，每个模组的L3缓存是2.5MB到3MB左右，整个CPU Tile的共享L3缓存是10到12MB，这些内核依然采用环形总线互联。

预计Meteor Lake会在2023年发布，比较有可能先推出低功耗的移动版，随后会逐渐推广到整个消费级平台。

英特尔早在2021年第三季度首次对外展示了Meteor Lake测试芯片，其采用了Tile设计，至少会有三个不同的模块，分别是计算模块、SOC-LP模块（负责I/O）和GPU模块。英特尔会通过EMIB互联技术和Foveros封装技术，将不同制程节点和晶圆厂制造的模块进行堆叠，并封装在一起。英特尔会在Meteor Lake首次采用自家的Intel 4工艺，加入了EUV光刻技术，用于制造计算模块。

Meteor Lake使用的是第二代混合架构技术，性能核将启用Redwood Cove架构，以取代目前的Golden Cove架构，能效核会改用Crestmont架构，替换掉Gracemont架构。GPU模块最低配置96个EU，最高可配置192个EU，这可能是英特尔首款使用台积电（TSMC）制造的模块，采用3nm工艺制造。

预览var tableid = settableid(); document.write(''); Table().init({ title: "英特尔酷睿桌面处理器参数表", header: ["规格","Coffee Lake-S","Comet Lake-S","Rocket Lake-S","Alder Lake-S","Raptor Lake-S","Meteor Lake-S","Arrow Lake-S","Lunar Lake-S","Nova Lake-S"], width: '92%', columnWidth: 'MAX', //表格单元宽度，"MAX"最大内容显示，""AVG"平均，"AUTO"自动，指定[15,16,20] id: tableid, data: [ ["发布年份","2018","2020","2021Q1","2021Q4","2022","2023?","2024?","2024+?","2026?"], ["工艺节点","14nm","14nm","14nm","Intel 7","Intel 7","Intel 4 & 20ATSMC N3","Intel 4 & 20ATSMC N3","Intel 18ATSMC N2?","TBC"], ["核心架构","SkyLake","SkyLake","Cypress Cove","Golden CoveGracemont","Raptor CoveGracemont","Redwood CoveCrestmont","TBC","Lion CoveSkymont","Panther CoveDarkmont"], ["核显","Gen9","Gen9.5","Gen12","Gen12","Gen12?","Gen 12?","TBC","Gen 13","TBC"], ["最大核心数","8","10","8","16 (8+8)","24 (8+16)","TBC","40 (8+32)","TBC","TBC"], ["插座","LGA1151","LGA1200","LGA1200","LGA1700","LGA1700","TBC","TBC","TBC","TBC"], ["内存支持","DDR4","DDR4","DDR4","DDR4/5","DDR4/DDR5","DDR5","TBC","TBC","TBC"], ["PCIe版本","PCIe 3.0","PCIe 3.0","PCIe 4.0","PCIe 5.0","PCIe 5.0","PCIe 5.0?","PCIe 5.0?","PCIe 5.0?","PCIe 6.0?"], ["主板芯片组","Intel 300系列","Intel 400系列","Intel 500系列","Intel 600系列","Intel 700系列?","TBC","TBC","TBC","TBC"] ] });

英特尔早在2021年第三季度首次对外展示了Meteor Lake测试芯片，其采用了Tile设计，至少会有三个不同的模块，分别是计算模块、SOC-LP模块（负责I/O）和GPU模块。这些模块可以搭配不同制程节点的模块进行堆叠，包括使用其他晶圆厂制造的模块，再使用EMIB技术互联。通过Foveros封装技术，直接将不同IP、不同工艺的各种成熟方案封装在一起。英特尔会在Meteor Lake首次采用自家的Intel 4工艺，加入了EUV光刻技术。

Meteor Lake的GPU模块最低配置96个EU，最高可配置192个EU，相比Alder Lake和Raptor Lake有大幅度的提升。可能这是英特尔首款使用台积电（TSMC）制造的模块，采用3nm工艺制造，SOC-LP模块则采用台积电的4nm或5nm工艺制造，剩下的计算模块才是英特尔自己的Intel 4工艺。

此外，帕特-基尔辛格还确认了在2022年第一季度向特定的合作伙伴提供了Sapphire Rapids，更多的型号将会在今年内陆续推出。按照之前内存厂商宇瞻（Apacer）有关DDR5内存的介绍资料，Sapphire Rapids将会在2022年第三季度或第四季度正式到来。

其中Meteor Lake的GPU模块最低配置96个EU，最高可配置192个EU，相比Alder Lake和Raptor Lake有大幅度的提升。同时，其Xe-LP架构也会由Gen 12.2改进为Gen 12.7。据Ctee报道，Meteor Lake的GPU模块还将采用台积电（TSMC）的3nm工艺制造，SOC-LP模块则采用台积电的4nm或5nm工艺制造，剩下的计算模块才是英特尔自己的7nm工艺。

此外，Meteor Lake使用的是第二代混合架构技术，性能核将启用Redwood Cove架构，以取代目前的Golden Cove架构，能效核应该会继续使用Gracemont架构，不过暂时还不清楚Meteor Lake的核心配置情况。

预览var tableid = settableid(); document.write(''); Table().init({ title: "英特尔酷睿桌面处理器参数表", header: ["规格","Coffee Lake-S","Comet Lake-S","Rocket Lake-S","Alder Lake-S","Raptor Lake-S","Meteor Lake-S","Lunar Lake-S"], width: '92%', columnWidth: 'MAX', //表格单元宽度，"MAX"最大内容显示，""AVG"平均，"AUTO"自动，指定[15,16,20] id: tableid, data: [ ["发布年份","2018","2020","2021Q1","2021Q4","2022","2023?","2024?"], ["工艺节点","14nm","14nm","14nm","Intel 7","Intel 7?","Intel 4","Intel 4?"], ["核心架构","SkyLake","SkyLake","Cypress Cove","Golden Cove+Gracemont","Raptor Cove+Gracemont?","Redwood Cove+Gracemont?","Lion Cove+Skymont?"], ["核显","Gen9","Gen9.5","Gen12","Gen12.2","Gen12.2","Gen12.7？","Gen 13"], ["最大核心数","8","10","8","16 (8+8)","16 (8+8)","TBC","TBC"], ["插座","LGA1151","LGA1200","LGA1200","LGA1700","LGA1700","LGA1700","TBC"], ["内存支持","DDR4","DDR4","DDR4","DDR4/5","DDR4/5","DDR5","DDR5"], ["PCIe版本","PCIe 3.0","PCIe 3.0","PCIe 4.0","PCIe 5.0","PCIe 5.0","PCIe 5.0","PCIe 5.0"], ["主板芯片组","Intel 300系列","Intel 400系列","Intel 500系列","Intel 600系列","TBC","TBC","TBC"] ] });

据TomsHardware报道，近日英特尔CEO帕特-基尔辛格（Pat Gelsinger）在本季度的财报电话会议上表示，Meteor Lake的计算模块已通电，并运行了30分钟，性能良好，符合预期，是最近看到的表现最好的初期产品之一，这证明了工艺的研发十分顺利。

由于Meteor Lake采用了模块化设计，可以搭配不同制程节点的模块进行堆叠，封装内可能有首款使用其他晶圆厂（台积电）制造的模块。Foveros封装技术可以将重新设计、测试、流片等过程统统省略，直接将不同IP、不同工艺的各种成熟方案封装在一起，从而大幅降低成本并提升产品上市速度。此前，英特尔已经决定在2023年起会将个别的芯片生产外包给第三方，而Foveros封装技术会更有利于英特尔为自己的芯片更好地安排生产。

据了解，Meteor Lake将会采用Tile设计，会有三个模块，分别是计算模块、SOC-LP模块（负责I/O）和GPU模块，其TDP会在5W到125W之间。同时会采用新的性能核心，被称为“Redwood Cove”的核心架构，以代替Alder Lake上使用的“Golden Cove”。此外，会大幅度提高其图形技术，核显最低配置就是96个EU，最高可配置192个EU。还有消息指，Meteor Lake或会集成视觉处理单元（VPU），而且会改用LGA 1800插座。

预览var tableid = settableid(); document.write(''); Table().init({ title: "英特尔酷睿桌面处理器参数表", header: ["规格","Coffee Lake-S","Comet Lake-S","Rocket Lake-S","Alder Lake-S","Raptor Lake-S","Meteor Lake-S","Lunar Lake-S"], width: '92%', columnWidth: 'MAX', //表格单元宽度，"MAX"最大内容显示，""AVG"平均，"AUTO"自动，指定[15,16,20] id: tableid, data: [ ["发布年份","2018","2020","2021","2021Q4","2022","2023?","2024?"], ["工艺节点","14nm","14nm","14nm","10nm Enhanced SuperFin","10nm Enhanced SuperFin?","7nm SuperFin?","7nm Enhanced SuperFin?"], ["核心架构","SkyLake","SkyLake","Cypress Cove","Golden Cove+Gracemont","Golden Cove+Gracemont?","Redwood Cove+Gracemont?","TBC"], ["核显","Gen9","Gen9.5","Gen12","Gen12?","Gen12?","Gen 12?","Gen 13"], ["最大核心数","8","10","8","16 (8+8)","16 (8+8)","TBC","TBC"], ["插座","LGA1151","LGA1200","LGA1200","LGA1700","LGA1700","LGA1700/1800","TBC"], ["内存支持","DDR4","DDR4","DDR4","DDR4/5","DDR5","DDR5","DDR5"], ["PCIe版本","PCIe 3.0","PCIe 3.0","PCIe 4.0","PCIe 4.0/5.0","PCIe 5.0","PCIe 5.0","PCIe 5.0"], ["主板芯片组","Intel 300系列","Intel 400系列","Intel 500系列","Intel 600系列?","TBC","TBC","TBC"] ] });

据Wccftech报道，英特尔有可能在Meteor Lake上集成视觉处理单元（VPU），嵌入的位置将会在CPU核心运算模块旁边，其作用与苹果M1的神经网络引擎相似，以大幅度提升机器学习（ML）任务的处理速度。英特尔计划自己开发类似的技术，希望配备VPU以后可以减轻CPU数据处理的压力，提高运算效率。对于一些相对低规格或者低功耗的处理器来说，这是一种有效的性能提升方法，用户在日常使用中进行语音识别等操作会很有帮助。如果英特尔真的打算在Meteor Lake上这么做，相信也会有不少的应用程序会跟进优化。预计Meteor Lake将会在2023年发布，目前还有不少操作的空间。

据了解，AMD代号Van Gogh和Rembrandt的APU也会引入相关功能。前者在此前泄露的信息里显示会支持CVML，具备一定的AI计算能力，已确认将用在Valve名为Steam Deck的Steam掌机上。后者是面向台式机和移动设备的Ryzen APU，很可能成为普通消费者第一个接触到该技术的PC平台处理器。

近日推特用户@momomo_us分享了一张插座盖的图片，列出其兼容LGA-18XX的字样。在此前Igor's Lab曝光的LGA 1700插座的散热器安装要求里，就有提到名为LGA 1800的插座。其相关的处理器散热器安装机制表明，LGA 1700插座和LGZ1800插座有一定的兼容性。这也说明了，LGA 1800是属于英特尔平台的插座，而不是AMD平台。

暂时还不清楚会是英特尔的哪一款产品使用。有消息指，LGA 18XX插座是用于接替LGA 1700插座，首款使用新插座的处理器是Meteor Lake，这也是英特尔首款采用7nm工艺制造的处理器。另外也有消息指出，LGA 18XX插座可能用于不同系列的产品，比如采用至强处理器的工作站。之前有传言称，英特尔希望LGA 1700插座能沿用至少三代产品，其中还包括了Meteor Lake。现阶段英特尔也不会证实这种说法，也没有其他方法证明。

预览var tableid = settableid(); document.write(''); Table().init({ title: "英特尔酷睿桌面处理器参数表", header: ["规格","Coffee Lake-S","Comet Lake-S","Rocket Lake-S","Alder Lake-S","Raptor Lake-S","Meteor Lake-S","Lunar Lake-S"], width: '92%', columnWidth: 'MAX', //表格单元宽度，"MAX"最大内容显示，""AVG"平均，"AUTO"自动，指定[15,16,20] id: tableid, data: [ ["发布年份","2018","2020","2021","2021Q4","2022","2023?","2024?"], ["工艺节点","14nm","14nm","14nm","10nm Enhanced SuperFin","10nm Enhanced SuperFin?","7nm Enhanced SuperFin?","TBC"], ["核心架构","SkyLake","SkyLake","Cypress Cove","Golden Cove+Gracemont","Golden Cove+Gracemont?","Redwood Cove+Gracemont?","TBC"], ["核显","Gen9","Gen9.5","Gen12","Gen12?","Gen12?","Gen 12?","Gen 13"], ["最大核心数","8","10","8","16 (8+8)","16 (8+8)","TBC","TBC"], ["插座","LGA1151","LGA1200","LGA1200","LGA1700","LGA1700","LGA1700","TBC"], ["内存支持","DDR4","DDR4","DDR4","DDR4/5","DDR5","DDR5","DDR5"], ["PCIe版本","PCIe 3.0","PCIe 3.0","PCIe 4.0","PCIe 4.0/5.0","PCIe 5.0","PCIe 5.0","PCIe 5.0"], ["主板芯片组","Intel 300系列","Intel 400系列","Intel 500系列","Intel 600系列?","TBC","TBC","TBC"] ] });

“Tape in”是较为新的一个术语，意味着采用不同工艺的模块进行堆叠，再使用英特尔Foveros技术完成封装，而Meteor Lake将是应用这种设计的产品之一。Foveros技术可以将重新设计、测试、流片等过程统统省略，直接将不同IP、不同工艺的各种成熟方案封装在一起，从而大幅降低成本并提升产品上市速度。此前，英特尔已经决定了，在2023年起会将个别的芯片生产外包给第三方，而Foveros技术有利于英特尔为自己的芯片更好地安排生产。

Meteor Lake会使用新的核心，称为Redwood Cove，并将采用7nm Enhanced SuperFin工艺制造，会使用极紫外光刻（EUV）技术，并继续使用LGA 1700底座。在今年3月份，帕特-基尔辛格宣布“IDM 2.0”战略的时候，已确认作为第14代酷睿系列的Meteor Lake将于2023年发布。

预览var tableid = settableid(); document.write(''); Table().init({ title: "英特尔酷睿桌面处理器参数表", header: ["规格","Coffee Lake-S","Comet Lake-S","Rocket Lake-S","Alder Lake-S","Raptor Lake-S","Meteor Lake-S","Lunar Lake-S"], width: '92%', columnWidth: 'MAX', //表格单元宽度，"MAX"最大内容显示，""AVG"平均，"AUTO"自动，指定[15,16,20] id: tableid, data: [ ["发布年份","2018","2020","2021","2021Q4","2022","2023?","2024?"], ["工艺节点","14nm","14nm","14nm","10nm Enhanced SuperFin","10nm Enhanced SuperFin?","7nm Enhanced SuperFin?","TBC"], ["核心架构","SkyLake","SkyLake","Cypress Cove","Golden Cove+Gracemont","Golden Cove+Gracemont?","Redwood Cove+Gracemont?","TBC"], ["核显","Gen9","Gen9.5","Gen12","Gen12?","Gen12?","Gen 12?","Gen 13"], ["最大核心数","8","10","8","16 (8+8)","16 (8+8)","TBC","TBC"], ["插座","LGA1151","LGA1200","LGA1200","LGA1700","LGA1700","LGA1700","TBC"], ["内存支持","DDR4","DDR4","DDR4","DDR4/5","DDR5","DDR5","DDR5"], ["PCIe版本","PCIe 3.0","PCIe 3.0","PCIe 4.0","PCIe 4.0/5.0","PCIe 5.0","PCIe 5.0","PCIe 5.0"], ["主板芯片组","Intel 300系列","Intel 400系列","Intel 500系列","Intel 600系列?","TBC","TBC","TBC"] ] });