此前就有报道称，Lunar Lake采用一种全新的CPU架构和全新的底层设计，主要专注于移动设备的每瓦性能改进，将在2024年流片（Tape Out）并做好生产准备。其最初设计是针对15W低功耗移动处理器细分市场，以打造超薄及轻便的系统，这与Arrow Lake-U的定位是一样的。

按照之前的说法，Arrow Lake-S的最高配置与现有的Raptor Lake-S相同，均为8个P-Core和16个E-Core，共24核心32线程。改用Lion Cove架构的P-Core是Arrow Lake性能提升的主要来源，其IPC相比Meteor Lake的Redwood Cove架构提高了20%，相比Alder Lake的Golden Cove架构提高了45%。

Moore's Law Is Dead表示，Arrow Lake-S的计算模块会采用台积电（TSMC）的3nm制造，而移动版本才会采用Intel 20A工艺，这意味着桌面版本几乎等同于完全由台积电代工。英特尔希望基于Lion Cove架构的P-Core能有更好的性能表现，IPC相比Redwood Cove架构的P-Core能有22%至34%的提升幅度。

预览var tableid = settableid(); document.write(''); Table().init({ title: "英特尔酷睿桌面处理器参数表", header: ["规格","Coffee Lake-S","Comet Lake-S","Rocket Lake-S","Alder Lake-S","Raptor Lake-S","Meteor Lake-S","Arrow Lake-S","Lunar Lake-S","Nova Lake-S"], width: '92%', columnWidth: 'MAX', //表格单元宽度，"MAX"最大内容显示，""AVG"平均，"AUTO"自动，指定[15,16,20] id: tableid, data: [ ["发布年份","2018","2020","2021Q1","2021Q4","2022","2023?","2024H1?","2024+?","2026?"], ["工艺节点","14nm","14nm","14nm","Intel 7","Intel 7","Intel 4TSMC N5TSMC N6","Intel 20ATSMC N3TSMC N6","Intel 18ATSMC N2?","TBC"], ["核心架构","SkyLake","SkyLake","Cypress Cove","Golden CoveGracemont","Raptor CoveGracemont","Redwood CoveCrestmont","Lion CoveSkymont","Lion Cove?Skymont?","Panther CoveDarkmont"], ["核显","Gen9.5","Gen9.5","Gen12","Gen12","Gen12","Gen 13?","Gen 13?","TBC","TBC"], ["最大核心数","8","10","8","16 (8+8)","24 (8+16)","22 (6+16)","24 (8+16)","TBC","TBC"], ["插座","LGA1151","LGA1200","LGA1200","LGA1700","LGA1700","LGA1851","LGA1851","TBC","TBC"], ["内存支持","DDR4","DDR4","DDR4","DDR4/5","DDR4/DDR5","DDR5","DDR5","TBC","TBC"], ["PCIe版本","PCIe 3.0","PCIe 3.0","PCIe 4.0","PCIe 5.0","PCIe 5.0","PCIe 5.0?","PCIe 5.0?","PCIe 5.0?","PCIe 6.0?"], ["主板芯片组","Intel 300系列","Intel 400系列","Intel 500系列","Intel 600系列","Intel 700系列","TBC","Intel 800系列?","TBC","TBC"] ] });

英特尔的800系列芯片组包括了Z890、B860和H810三款，H870被取消。W880和Q870将分别面向入门级工作站和商用市场，且都支持英特尔vPro技术。Arrow Lake-S将支持DDR5-6400内存，每个模块最大容量为48GB。

Z890最高拥有60个HSIO通道，包含了来自CPU的26个和来自PCH的34个，B860和H810平台分别最多有44个和32个HSIO通道。此外，Z890、W880和Q870的DMI 4.0通道数为8条，而B860和H810只有4条。

预览var tableid = settableid(); document.write(''); Table().init({ title: "英特尔酷睿桌面处理器参数表", header: ["规格","Coffee Lake-S","Comet Lake-S","Rocket Lake-S","Alder Lake-S","Raptor Lake-S","Meteor Lake-S","Arrow Lake-S","Lunar Lake-S","Nova Lake-S"], width: '92%', columnWidth: 'MAX', //表格单元宽度，"MAX"最大内容显示，""AVG"平均，"AUTO"自动，指定[15,16,20] id: tableid, data: [ ["发布年份","2018","2020","2021Q1","2021Q4","2022","2023?","2024H1?","2024+?","2026?"], ["工艺节点","14nm","14nm","14nm","Intel 7","Intel 7","Intel 4TSMC N5TSMC N6","Intel 20ATSMC N3TSMC N6","Intel 18ATSMC N2?","TBC"], ["核心架构","SkyLake","SkyLake","Cypress Cove","Golden CoveGracemont","Raptor CoveGracemont","Redwood CoveCrestmont","Lion CoveSkymont","Lion Cove?Skymont?","Panther CoveDarkmont"], ["核显","Gen9.5","Gen9.5","Gen12","Gen12","Gen12","Gen 13?","Gen 13?","TBC","TBC"], ["最大核心数","8","10","8","16 (8+8)","24 (8+16)","22 (6+16)","24 (8+16)","TBC","TBC"], ["插座","LGA1151","LGA1200","LGA1200","LGA1700","LGA1700","LGA1851","LGA1851","TBC","TBC"], ["内存支持","DDR4","DDR4","DDR4","DDR4/5","DDR4/DDR5","DDR5","DDR5","TBC","TBC"], ["PCIe版本","PCIe 3.0","PCIe 3.0","PCIe 4.0","PCIe 5.0","PCIe 5.0","PCIe 5.0?","PCIe 5.0?","PCIe 5.0?","PCIe 6.0?"], ["主板芯片组","Intel 300系列","Intel 400系列","Intel 500系列","Intel 600系列","Intel 700系列","TBC","Intel 800系列?","TBC","TBC"] ] });

@harukaze5719在LinkedIn上发现一位Intel GPU工程师的个人资料，可以看到Meteror Lake和Arrow Lake将采用Xe-LPG架构核显，而Lunar Lake将使用Xe2-LPG架构核显，它与Battlemage GPU的Xe2-HPG同源，再下一代的Panther Lake将使用Xe3-LPG架构核显，与Celectial GPU的Xe3-HPG同源。有趣的是Panther Lake这个代号是首次出现，它是Lunar Lake的继任者，预计会在2025到2026年推出。

实际上Intel此前就放出过酷睿处理器和Arc显卡的产品线路图，从图上就能看到Arc Tile GPU会成为未来酷睿处理器的一部分，但这张PPT里面没说的是，酷睿处理器里面的核显会比独显晚一代架构。

当然目前这份消息并没有得到确认，而且现在离产品正式发布还有不少时间，Intel肯定会根据实际情况来调整产品组合，毕竟在下一代改用Foveros封装后，酷睿处理器的灵活性会大幅增加，用什么架构的CPU搭配什么架构的GPU其实换个芯粒就行了，不过目前来看Meteror Lake的桌面产品进展可能不太顺利，随时可能会被取消。

据RGT报道，Arrow Lake的P-Core和E-Core都有明显的性能提升。其中改用Lion Cove架构的P-Core是性能主要的提升来源，其IPC相比Meteor Lake的Redwood Cove架构提高了20%，相比Alder Lake的Golden Cove架构提高了45%。此外，Skymont架构的E-Core在性能上的提升也会“令人印象深刻”，不过并没有给出数值。

Arrow Lake-S最高配置与目前的Raptor Lake-S相同，具有8个P-Core和16个E-Core，共24核心32线程，暂时不清楚核显的Xe内核是否也会采用新的架构。传闻Arrow Lake的频率会高于Meteor Lake，后者与Raptor Lake相比，频率会有些许下降。

预览var tableid = settableid(); document.write(''); Table().init({ title: "英特尔酷睿桌面处理器参数表", header: ["规格","Coffee Lake-S","Comet Lake-S","Rocket Lake-S","Alder Lake-S","Raptor Lake-S","Meteor Lake-S","Arrow Lake-S","Lunar Lake-S","Nova Lake-S"], width: '92%', columnWidth: 'MAX', //表格单元宽度，"MAX"最大内容显示，""AVG"平均，"AUTO"自动，指定[15,16,20] id: tableid, data: [ ["发布年份","2018","2020","2021Q1","2021Q4","2022","2023?","2024?","2024+?","2026?"], ["工艺节点","14nm","14nm","14nm","Intel 7","Intel 7","Intel 4TSMC N5TSMC N6","Intel 20ATSMC N3TSMC N6","Intel 18ATSMC N2?","TBC"], ["核心架构","SkyLake","SkyLake","Cypress Cove","Golden CoveGracemont","Raptor CoveGracemont","Redwood CoveCrestmont","Lion CoveSkymont","Lion Cove?Skymont?","Panther CoveDarkmont"], ["核显","Gen9.5","Gen9.5","Gen12","Gen12","Gen12","Gen 13?","Gen 13?","TBC","TBC"], ["最大核心数","8","10","8","16 (8+8)","24 (8+16)","22 (6+16)","24 (8+16)","TBC","TBC"], ["插座","LGA1151","LGA1200","LGA1200","LGA1700","LGA1700","LGA1851","LGA1851","TBC","TBC"], ["内存支持","DDR4","DDR4","DDR4","DDR4/5","DDR4/DDR5","DDR5","TBC","TBC","TBC"], ["PCIe版本","PCIe 3.0","PCIe 3.0","PCIe 4.0","PCIe 5.0","PCIe 5.0","PCIe 5.0?","PCIe 5.0?","PCIe 5.0?","PCIe 6.0?"], ["主板芯片组","Intel 300系列","Intel 400系列","Intel 500系列","Intel 600系列","Intel 700系列","TBC","TBC","TBC","TBC"] ] });

近日有网友透露，英特尔可能取消Meteor Lake的桌面版本，也就是采用LGA 1851插座的Meteor Lake-S。根据之前的消息，Meteor Lake-S将减少性能核（Performance Core）的数量，同时保留相同数量的能效核（Efficient Core），意味着最大的核心数为22个，完整的配置列表包括：

Meteor Lake-S 22 (6P + 16E) / 4 Xe Cores / 125W TDP

Meteor Lake-S 22 (6P + 16E) / 4 Xe Cores / 65W TDP

Meteor Lake-S 22 (6P + 16E) / 4 Xe Cores / 35W TDP

Meteor Lake-S 14 (6P + 8E) / 4 Xe Cores / 65WTDP

Meteor Lake-S 14 (6P + 8E) / 4 Xe Cores / 35WTDP

此外，传闻下一代的LGA 1851插座将支持三代产品，如果不包含Meteor Lake-S，那么有可能是Arrow Lake-S、Arrow Lake Refresh和Panther Lake-S（或者也称为Nova Lake-S）。Arrow Lake-S最高配置与目前的Raptor Lake-S相同，具有8个P-Core和16个E-Core，共24个核心，完整的配置列表包括：

Arrow Lake-S 24 (8P + 16E) / 4 Xe Cores / 125W TDP

Arrow Lake-S 24 (8P + 16E) / 4 Xe Cores / 65W TDP

Arrow Lake-S 24 (8P + 16E) / 4 Xe Cores / 35W TDP

相比Meteor Lake-S，Arrow Lake-S主要是增加了2个P-Core，P-Core将采用Lion Cove架构，E-Core则是Skymont架构，不清楚Xe内核是否会采用新的架构。英特尔也会引入新的工艺，计算模块采用的是Intel 20A工艺，GPU模块采用台积电3nm工艺。

预览var tableid = settableid(); document.write(''); Table().init({ title: "英特尔酷睿桌面处理器参数表", header: ["规格","Coffee Lake-S","Comet Lake-S","Rocket Lake-S","Alder Lake-S","Raptor Lake-S","Meteor Lake-S","Arrow Lake-S","Lunar Lake-S","Nova Lake-S"], width: '92%', columnWidth: 'MAX', //表格单元宽度，"MAX"最大内容显示，""AVG"平均，"AUTO"自动，指定[15,16,20] id: tableid, data: [ ["发布年份","2018","2020","2021Q1","2021Q4","2022","2023?","2024?","2024+?","2026?"], ["工艺节点","14nm","14nm","14nm","Intel 7","Intel 7","Intel 4TSMC N5TSMC N6","Intel 20ATSMC N3TSMC N6","Intel 18ATSMC N2?","TBC"], ["核心架构","SkyLake","SkyLake","Cypress Cove","Golden CoveGracemont","Raptor CoveGracemont","Redwood CoveCrestmont","Lion Cove？Skymont?","Lion CoveSkymont","Panther CoveDarkmont"], ["核显","Gen9.5","Gen9.5","Gen12","Gen12","Gen12","Gen 13?","Gen 13?","TBC","TBC"], ["最大核心数","8","10","8","16 (8+8)","24 (8+16)","22 (6+16)","24 (8+16)","TBC","TBC"], ["插座","LGA1151","LGA1200","LGA1200","LGA1700","LGA1700","LGA1851","LGA1851","TBC","TBC"], ["内存支持","DDR4","DDR4","DDR4","DDR4/5","DDR4/DDR5","DDR5","TBC","TBC","TBC"], ["PCIe版本","PCIe 3.0","PCIe 3.0","PCIe 4.0","PCIe 5.0","PCIe 5.0","PCIe 5.0?","PCIe 5.0?","PCIe 5.0?","PCIe 6.0?"], ["主板芯片组","Intel 300系列","Intel 400系列","Intel 500系列","Intel 600系列","Intel 700系列","TBC","TBC","TBC","TBC"] ] });

而到了15代的Arrow Lake，可能会出现桌面版和移动版的CPU模块采用不同制程的情况，这是@OneRaichu所透露的情报，桌面版的Arrow Lake-S可能会用台积电N3工艺，而移动版的Arrow Lake-P则会采用Intel 20A工艺，这里指的都是CPU模块，没啥意外的话Arrow Lake的SOC和IO模块与Meteor Lake应该是一样的，而GPU模块基本确定是用台积电N3工艺了，如果这情报属实的话那么桌面版的Arrow Lake几乎整个都交给台积电生产了。

Meteor Lake与Arrow Lake的桌面版本都会采用LGA 1851接口，其中Meteor Lake的P-Core是Redwood Cove，E-Core则是Crestmont，而Arrow Lake则是Lion Cove架构的P-Core搭配Skymont架构的E-Core，目前已知的是Arrow Lake最多会有8P+32E，Meteor Lake会是怎么样现在还不太清楚，有可能和现在的Raptor Lake一样是8P+16E。

移动版Arrow Lake的CPU模块所用的Intel 20A工艺其实就是原来的Intel 5nm工艺，采用EUV，将使用下一代RibbonFET和PowerVia技术，每瓦性能提高15%，计划是在2022年下半年开始在晶圆厂试产第一批测试晶圆，但不知道目前进度怎么样。

由于Meteor Lake采用的是模块化设计，除了使用自己新的Intel 4工艺，还会利用台积电的N3工艺制造的GPU模块。针对媒体的报道，英特尔官方对此事进行了澄清，表示Meteor Lake仍在按计划进行。近日有网友透露，Meteor Lake不会有台积电N3工艺制造的模块，要等到Arrow Lake，也就是第15代酷睿才会引入。

有其他网友对这种说法予以支持，表示Meteor Lake移动版本的GPU将从台积电的N3工艺换成N5工艺，EU数量也由原计划的192个减少到128个。如果传言属实，说明Meteor Lake的计划在这段时间里发生了重大的变化。

传闻英特尔CEO帕特-基尔辛格（Pat Gelsinger）已经和台积电重新谈判，延后一代产品引入意味着要多等一年以上才能看到英特尔采用台积电N3工艺，或许英特尔还会在GPU上采用新的架构。

预览var tableid = settableid(); document.write(''); Table().init({ title: "英特尔酷睿桌面处理器参数表", header: ["规格","Coffee Lake-S","Comet Lake-S","Rocket Lake-S","Alder Lake-S","Raptor Lake-S","Meteor Lake-S","Arrow Lake-S","Lunar Lake-S","Nova Lake-S"], width: '92%', columnWidth: 'MAX', //表格单元宽度，"MAX"最大内容显示，""AVG"平均，"AUTO"自动，指定[15,16,20] id: tableid, data: [ ["发布年份","2018","2020","2021Q1","2021Q4","2022","2023?","2024?","2024+?","2026?"], ["工艺节点","14nm","14nm","14nm","Intel 7","Intel 7","Intel 4TSMC N5?","Intel 4 & 20ATSMC N3?","Intel 18ATSMC N2?","TBC"], ["核心架构","SkyLake","SkyLake","Cypress Cove","Golden CoveGracemont","Raptor CoveGracemont","Redwood CoveCrestmont","TBC","Lion CoveSkymont","Panther CoveDarkmont"], ["核显","Gen9.5","Gen9.5","Gen12","Gen12","Gen13?","Gen 13?","TBC","TBC","TBC"], ["最大核心数","8","10","8","16 (8+8)","24 (8+16)","TBC","40 (8+32)","TBC","TBC"], ["插座","LGA1151","LGA1200","LGA1200","LGA1700","LGA1700","TBC","TBC","TBC","TBC"], ["内存支持","DDR4","DDR4","DDR4","DDR4/5","DDR4/DDR5","DDR5","TBC","TBC","TBC"], ["PCIe版本","PCIe 3.0","PCIe 3.0","PCIe 4.0","PCIe 5.0","PCIe 5.0","PCIe 5.0?","PCIe 5.0?","PCIe 5.0?","PCIe 6.0?"], ["主板芯片组","Intel 300系列","Intel 400系列","Intel 500系列","Intel 600系列","Intel 700系列?","TBC","TBC","TBC","TBC"] ] });

据Benchlife报道，下一代LGA 1851插座的尺寸为45 × 37.5 mm，与Alder Lake和Raptor Lake的LGA 1700/1800相同，因此有可能在CPU散热器方面保留一定的兼容性。泄露的PPT资料显示，LGA 1851插座的IHS（集成散热器）高度为6.83mm至7.49mm，相比目前的LGA 1700插座的6.73mm至7.4mm有所改变。

Meteor Lake的高度改变，很可能是由于新架构采用了Foveros封装技术的结果。与以往不同的是，从PPT上的信息来看，Meteor Lake似乎会是Arrow Lake的继任者，与之前一直流传的消息相反，不过英特尔至今没有分享太多有关Arrow Lake的信息，具体情况还有待观察。

预览var tableid = settableid(); document.write(''); Table().init({ title: "英特尔酷睿桌面处理器参数表", header: ["规格","Coffee Lake-S","Comet Lake-S","Rocket Lake-S","Alder Lake-S","Raptor Lake-S","Meteor Lake-S","Arrow Lake-S","Lunar Lake-S","Nova Lake-S"], width: '92%', columnWidth: 'MAX', //表格单元宽度，"MAX"最大内容显示，""AVG"平均，"AUTO"自动，指定[15,16,20] id: tableid, data: [ ["发布年份","2018","2020","2021Q1","2021Q4","2022","2023?","2024?","2024+?","2026?"], ["工艺节点","14nm","14nm","14nm","Intel 7","Intel 7","Intel 4 & 20ATSMC N3","Intel 4 & 20ATSMC N3","Intel 18ATSMC N2?","TBC"], ["核心架构","SkyLake","SkyLake","Cypress Cove","Golden CoveGracemont","Raptor CoveGracemont","Redwood CoveCrestmont","TBC","Lion CoveSkymont","Panther CoveDarkmont"], ["核显","Gen9","Gen9.5","Gen12","Gen12","Gen12?","Gen 12?","TBC","Gen 13","TBC"], ["最大核心数","8","10","8","16 (8+8)","24 (8+16)","TBC","40 (8+32)","TBC","TBC"], ["插座","LGA1151","LGA1200","LGA1200","LGA1700","LGA1700","TBC","TBC","TBC","TBC"], ["内存支持","DDR4","DDR4","DDR4","DDR4/5","DDR4/DDR5","DDR5","TBC","TBC","TBC"], ["PCIe版本","PCIe 3.0","PCIe 3.0","PCIe 4.0","PCIe 5.0","PCIe 5.0","PCIe 5.0?","PCIe 5.0?","PCIe 5.0?","PCIe 6.0?"], ["主板芯片组","Intel 300系列","Intel 400系列","Intel 500系列","Intel 600系列","Intel 700系列?","TBC","TBC","TBC","TBC"] ] });

根据过往的消息，Meteor Lake和Arrow Lake分别会在2023年和2024年发布，采用Tile设计，通过EMIB互联技术和Foveros封装技术，将不同制程节点和晶圆厂制造的模块进行堆叠，并封装在一起。其中涉及到的工艺包括了Intel4和Intel 20A，以及台积电的N3。普遍认为Meteor Lake和Arrow Lake将使用同一个平台，两者之间的关系类似于Alder Lake和Raptor Lake。

在前一段时间与分析师和投资者举行的财报电话会议中，英特尔CEO帕特-基尔辛格（Pat Gelsinger）表示，Meteor Lake（第14代酷睿）已成功地在Windows、Chrome和Linux系统中点亮，这是一个新的里程碑，标志着Intel 4工艺（7nm制程）技术进展顺利。随后英特尔又在Intel Vision向参观媒体展示了Meteor Lake芯片，两种封装方式，分别为“标准”和“高密度”。

据了解，Meteor Lake将首先在移动平台上推出，也是第一个采用Xe-HPG架构的酷睿系列。传闻Arrow Lake-P的核显将配备多达320个EU，是Alder Lake-P的三倍有余。

据AdoredTV报道，英特尔的Arrow Lake-P将会配备有6个性能核（Performance Core）和8个能效核（Efficient Core），以及320个EU的核显，图形性能将会有大幅度提升。早在去年8月份，AdoredTV就提到了Arrow Lake-P，应该有相对可靠的消息源。

不过也有人对此提出疑问，以英特尔未来几代产品的核心数量配置，6+8这样的规格似乎有点过低，虽然根据规划，英特尔目前在移动平台上最高性能的档位使用的是“S”后缀的芯片。

泄露的PPT显示，这款代号“Halo”的Arrow Lake-P搭载平台瞄准的是苹果14英寸的笔记本电脑，很可能是EVO平台的一部分。Arrow Lake-P将采用模块化设计，其中计算模块采用Intel 20A工艺制造，英特尔提及了需要台积电的N3工艺，这意味着SOC-LP模块（负责I/O）和GPU模块有可能仍是台积电负责生产。

据称移动平台的Arrow Lake-P比桌面平台的Arrow Lake-S有更高的优先级，后者将与Meteor Lake-S使用相同的底座，Arrow Lake将作为第15代酷睿系列登场。

预览var tableid = settableid(); document.write(''); Table().init({ title: "英特尔酷睿桌面处理器参数表", header: ["规格","Coffee Lake-S","Comet Lake-S","Rocket Lake-S","Alder Lake-S","Raptor Lake-S","Meteor Lake-S","Arrow Lake-S","Lunar Lake-S","Nova Lake-S"], width: '92%', columnWidth: 'MAX', //表格单元宽度，"MAX"最大内容显示，""AVG"平均，"AUTO"自动，指定[15,16,20] id: tableid, data: [ ["发布年份","2018","2020","2021Q1","2021Q4","2022","2023?","2024?","2024+?","2026?"], ["工艺节点","14nm","14nm","14nm","Intel 7","Intel 7","Intel 4 & 20ATSMC N3","Intel 4 & 20ATSMC N3","Intel 18ATSMC N2?","TBC"], ["核心架构","SkyLake","SkyLake","Cypress Cove","Golden CoveGracemont","Raptor CoveGracemont","Redwood CoveGracemont","TBC","Lion CoveSkymont","Panther CoveDarkmont"], ["核显","Gen9","Gen9.5","Gen12","Gen12","Gen12?","Gen 12?","TBC","Gen 13","TBC"], ["最大核心数","8","10","8","16 (8+8)","24 (8+16)","TBC","40 (8+32)","TBC","TBC"], ["插座","LGA1151","LGA1200","LGA1200","LGA1700","LGA1700","TBC","TBC","TBC","TBC"], ["内存支持","DDR4","DDR4","DDR4","DDR4/5","DDR4/DDR5","DDR5","TBC","TBC","TBC"], ["PCIe版本","PCIe 3.0","PCIe 3.0","PCIe 4.0","PCIe 5.0","PCIe 5.0","PCIe 5.0?","PCIe 5.0?","PCIe 5.0?","PCIe 6.0?"], ["主板芯片组","Intel 300系列","Intel 400系列","Intel 500系列","Intel 600系列","Intel 700系列?","TBC","TBC","TBC","TBC"] ] });